What are the factors that affect the thermal conductivity of PCB aluminum nitride (AlN) ceramic substrate? aln material properties
Aluminum nitride (AlN), as a structurally steady hexagonal wurtzite covalently bound substance, has actually shown large application potential in the fields of electronic devices and optoelectronics because of its distinct physical and chemical buildings. Its crystal framework is based upon an AlN4 tetrahedron as the basic system, with area group P63mc belonging to the hexagonal crystal system. This framework provides AlN a collection of exceptional properties.
Highlight of AlN porcelains
High thermal conductivity: Compared to alumina ceramics, the thermal conductivity of AlN is 5 to 10 times higher. Theoretically, the thermal conductivity of single crystal products at 300K can reach 319W/(m · K).
Thermal expansion matching: Its thermal development coefficient resembles that of semiconductor silicon materials, which contributes to device assimilation.
Superb mechanical and electric homes: It has high insulation resistance and low dielectric loss and is suitable for high-reliability digital product packaging.
Hassle-free for multi-layer circuitry: sustains miniaturization and high-density combination of packaging.
Eco-friendly: The safe characteristics fulfill modern-day environmental protection demands.
(Aluminum Nitride (AlN) Crystal Structure)
Variables impacting the thermal conductivity of AlN ceramics
Although the theoretical thermal conductivity of AlN is very high, its performance in practical applications is restricted by many variables, mainly including:
1. Microstructure: Phonon scattering is the crucial system of heat conduction. Grain limits, interfaces, second phases, defects, and so on, will impact the mean free course of phonons, thus affecting thermal conductivity. High-purity, low-defect single-crystal AlN has a much longer phonon-free course and greater thermal conductivity.
2. Oxygen pollutant web content: The strong affinity of AlN with oxygen makes it simple to present oxygen pollutants, forming aluminum oxide films and latticework flaws, such as light weight aluminum jobs, which significantly decrease the mean totally free path of phonons and therefore minimize thermal conductivity. When the oxygen focus is listed below 0.75%, oxygen atoms mainly change nitrogen atoms; exceeding this concentration will certainly lead to the loss of light weight aluminum openings and the generation of ductility flaws, better influencing thermal conductivity.
3. Sintering process and ingredients: By picking ideal sintering ingredients (such as Y2O3-Li2O, Y2O3-CaC2 and other composite systems), densification sintering can be achieved at a reduced temperature level while lowering the formation of oxygen pollutants and second phases, successfully boosting the thermal conductivity of AlN porcelains. The duty of these ingredients is to detoxify the grain borders, maximize the microstructure, and facilitate the reliable transmission of phonons.
Comprehensive approach
(TRUNNANO Aluminum Nitride (AlN) Powder)
In order to get AlN ceramics with high thermal conductivity, it is needed to think about the pureness of the product thoroughly, the sintering conditions and the choice of additives to minimize inner problems, especially to control the material of oxygen contaminations and maximize the microstructure.
By finely controlling the sintering process and taking on an effective composite sintering additive system, it is expected that the high thermal conductivity AlN substratum required for large-scale production applications can be attained while making certain material performance. This is not only crucial for boosting the heat dissipation effectiveness of electronic devices, yet additionally supplies an essential product basis for promoting the advancement of semiconductor modern technology.
Supplier of Light Weight Aluminum Nitride AlN Powder
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